Rough polish, 600 grit sand paper
 -> 50 um -> up to 0.05 um polisher

 DI water rinse/Metanol + dry nitrogen

 Then use chemicals below to decorate 
 die cross section.

 Chemicals(example) 
 1. HF - HNO3 - H2O
 2. BOE
 3. 20/1(20 - HNO3, 1 - HF)                    4. KOH (Satulated KOH, 85%/KOH/DF)
 5. CO (Common oxide: 7-HF, 1- NH4F)
 

Doped Si:
 20-1 (HNO3 - HF) (2 sec)

Metalization:
 KOH  ( 5 sec)

Oxide:
 BOE ( 2 Sec)
 20 - 1 (HNO3 - HF)  ( 2 sec)